Complete Guide on COB, MIP, and IMD
Chip-On-Board (COB) Technology– Chipflip
”CHIPFLIP” is a revolutionary new technology for encapsulating fine pixel pitch COB to PCB boards. Traditionally, the circuit design for SMD displays has both the Positive pole (Anode) and the Negative pole (Cathode) facing upwards. However, in the “CHIPFLIP” process, both electrodes face downward, enabling a unique encapsulation method.
There is no soldering in the “CHIPFLIP” process! The chip and substrate are electrically and mechanically interconnected by solder paste bonding.
The “CHIPFLIP” process also employs Common Cathode technology, where electric current passes through the Cathode (negative pole/ground). Power is only drawn as needed, significantly reducing heat generation.
MIP packaging technology (Micro LED In Package) is a packaging technique based on Micro LED. The organic combination of Micro LED with discrete devices is achieved by packaging an entire large-area display panel separately. The Micro LED chip is transferred to the substrate using mass transfer technology.
After packaging, it is cut into single or multi-in-one small chips, then split and mixed, and then the chip placement process and screen processing are carried out. The surface is covered with film to complete the LED display.
MIP devices are able to measure, sort, and mix RGB micropixels, ensuring highly consistent display panels.
MiP covers a wide range of product specifications (P0.9 to P3.0), eliminating the need for specific encapsulations for each specification. This mass adoption of established specifications reduces costs quickly.
MiP’s wafer-testing, massive transfer, uniform equipment/processes, and lower yield requirements provide substantial cost benefits, particularly when leveraging Micro LED’s manufacturing efficiency.
MiP integrates easily into existing COB or SMD production lines, reducing downstream investments and allowing for standardized processes.
High black ratio—Black ratio exceeding 99%.
Special optical design—Viewing angle horizontally exceeding 174°.
MIP packaging technology is a new solution for LED displays, overcoming limitations and challenges of existing technologies like SMD, IMD, and COB, particularly for large-size LED direct-view display products.
MiP technology follows a “whole-to-individual” approach—each micro LED chip is individually packaged, inspected, and binned like SMD, then made into a COB panel via SMT and surface treatment in traditional SMD factories.
IMD (Integrated Matrix Devices)
IMD refers to the packaging of two, four, six, or more groups of RGB diodes in a small unit, also known as “N-in-1.” Typical IMD models are generated as 2×2 or 4-in-1 packages, where each 4-in-1 package includes four SMDs, and each SMD includes three chips (red, green, and blue).
IMD is an intermediate product between SMD and COB, combining the advantages of both. IMD is a next-generation LED packaging technology that meets market demand in appearance and performance.
Higher reliability: Compared to traditional SMD, IMD has better anti-collision performance and higher SMT efficiency than COB.
Better color consistency: IMD addresses issues in damage protection, black consistency, seamless splicing, and light leakage.
Lower maintenance costs: If a single diode needs repair, maintenance is simpler compared to other technologies. IMD features higher contrast, better integration, easier maintenance, and lower cost—ideal for finer pitches.
Lower manufacturing cost: Traditional SMT 1010 machines can still be used for IMD production, allowing manufacturers to transition smoothly due to an existing mature SMT supply chain.
As pixel pitch continues to shrink, IMD faces the same physical limitations as SMD, limiting its long-term growth potential.
