Chromium Micro LED Fine Pixel Pitch LED Video Indoor Boards
Micro LED Technology
Micro LED Technology solders three (3) LED chips, 1 red, 1 blue, 1 green, directly onto a PCB board. The SMD process inserts the three (3) chips into a bulb/lamp which lamps are then affixed to a PCB Board. The Micro LED Technology manufacturing process results in a perfectly flat, uniform LED surface allowing for a flawless encapsulation of the chips using a clear epoxy resin. The encapsulation of SMD bulbs cannot result in a perfectly flat wall.
Micro LED Technology is a two (2) step manufacturing process as opposed to the four (4) step SMD process. THE Micro LED manufacturing process eliminates the need for a bracket and supports, thereby reducing the number soldering steps and as a result the number of possible failure points. See the diagram below. Micro LED Technology is up to ten (10) times more reliable than SMD. 10/ppm vs. 50- 100/ppm.
The encapsulation of the LED chips using clear epoxy resin creates a protective wall that is highly impact resistant. Micro LED Technology is a safeguard against the intrusion of humidity, and is also anti-static, anti-dust, and waterproof on the front of the display. Micro LED Technology also provides for a higher contrast ratio, sharpness and deeper colors than SMD/GOB.
Micro LED Technology will allow for exceptionally low, very reliable pixel pitches. The present reality is that SMD technology below P1 is unstable. To date SMD 0808 and Mini 4-in-1 technology is not dependable. Micro LED Technology has perfected the P0.94 and is developing P0.5! Incredible!
|Module Size||11.811" x 13.287"|
|Cabinet Size||23.622" x 13.287"|
|Power Voltage||48V (DC); 110~220V(AC)|
|Maintenance||100% Front Access|
|Screen||Max Power Consumption||144 W|
|Avg Power Consumption||45 W|
|Max Current||26.5A(5V); 2.75A(48V)|
|Horizontal View Angle||160|
|Vertical View Angle||160|
|Operating Temperature||-10C to +50C|
|Operating Humidity||20% to 90%|
|Life Span||100,000 Hours|
|Grayscale Processing||14-18 bit|